light bar led display LBD2011-XX LBD2011-XX data sheet 15 - feb. doc. no : qw0905- rev. : a date : - 2006 ligitek electronics co.,ltd. property of ligitek only
ligitek electronics co.,ltd. property of ligitek only 1/6 page part no. package dimensions LBD2011-XX note : 1.all dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 13.97 (0.55") 4.3 0.5 6.35(0.25") LBD2011-XX ligitek ? 0.45 typ 5.08(0.2") 12.7 (0.5") pin no.1 7.49(0.295") 8.0(0.315") 2.54x2=5.08 (0.2")
np cathode 6 1 LBD2011-XX 2 1 page 2/6 internal circuit diagram LBD2011-XX ligitek electronics co.,ltd. property of ligitek only pin no.1 electrical connection 3 4 3 4 anode cathode 5 6 nc anode LBD2011-XX part no.
3/6 page 15 h 60 40 mw ma ma unit symbol i f i fp pd parameter ligitek electronics co.,ltd. property of ligitek only ratings absolute maximum ratings at ta=25 forward current per chip power dissipation per chip peak forward current per chip (duty 1/10,0.1ms pulse width) 2:1 iv-m iv(mcd) vf(v) electrical typ. min. 1.35 0.8 typ. min. 2.1 1.7 2.6 max. t opr tstg 90 697 common cathode or anode p ( nm) (nm) chip emitted red gap material -25 ~ +85 -25 ~ +85 common cathode note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. part selection and application information(ratings at 25) solder temperature 1/16 inch below seating plane for 3 seconds at 260 part no LBD2011-XX storage temperature operating temperature a 10 ir reverse current per any chip LBD2011-XX part no.
4/6 page ligitek electronics co.,ltd. property of ligitek only if=20ma test condition if=20ma if=20ma if=10ma volt vf unit nm a nm p iv mcd reverse current any chip spectral line half-width forward voltage per chip peak wavelength luminous intensity per chip parameter test condition for each parameter symbol luminous intensity matching ratio iv-m irvr=5v LBD2011-XX part no.
r e l a t i v e i n t e n s i t y @ 2 0 m a 600 0.0 0.5 wavelength (nm) 700800900 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 10 1000 h chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward voltage(v) 2.03.04.05.01.0 0.0 1.5 1.0 0.5 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 1000 5/6 page LBD2011-XX part no.
page6/6 description reference standard mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 test condition test item operating life test high temperature storage test low temperature storage test 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 thermal shock test high temperature high humidity test solder resistance test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. LBD2011-XX part no.
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